Aluminum Nitride Ceramics (AlN)

Q: What thermal conductivity does your AlN reach?

Our two standard grades are DA-AN170 at ≥ 170 W/m·K and DA-AN200 at ≥ 200 W/m·K measured at 20 °C — roughly six to seven times the thermal conductivity of alumina — while remaining electrically insulating.

Aluminum nitride substrates with metallization

Material Overview

Copper's Conductivity, Ceramic's Insulation

Where heat must move but current must not, aluminum nitride outperforms alumina by nearly seven times in thermal conductivity — while its coefficient of expansion closely matches silicon, protecting bonded dies and circuits through thermal cycling.

Thermal conductivity 170–200 W/m·K at room temperature
C.T.E. matched to silicon (≈ 4.5 × 10⁻⁶/K) for die-attach reliability
High volume resistivity (> 10¹⁴ Ω·cm) and dielectric strength
Metallization options: Mo-Mn, W, thick-film and DBC/AMB-compatible surfaces
Thicknesses from 0.25 mm wafers to 30 mm heat spreaders, lapped or polished

Typical Properties

AlN Technical Data

Property (typical)	DA-AN170	DA-AN200
Thermal conductivity (W/m·K, 20 °C)	≥ 170	≥ 200
Bulk density (g/cm³)	3.25	3.26
Flexural strength (MPa)	≥ 350	≥ 380
C.T.E. (10⁻⁶/K, 20–400 °C)	4.5	4.5
Volume resistivity (Ω·cm, 20 °C)	> 10¹⁴	> 10¹⁴
Dielectric strength (kV/mm)	≥ 15	≥ 17
Max. service temperature (°C, air)	≈ 900	≈ 1000

Typical values for reference; custom specifications and full test reports available on request.

Product Series by Application

AlN Components by Industry

Semiconductor

Wafer-Processing Components

Electrostatic chuck (ESC) parts, wafer heaters and clamping rings, plasma-resistant insulators and lift-pin components where uniform temperature is critical to yield.

Power Electronics

Substrates & Heat Spreaders

DBC / AMB substrate blanks, IGBT and SiC-module heat spreaders, baseplates and cooling fins for electric-vehicle inverters, chargers and rail traction systems.

LED & Photonics

Package & Laser Heat Sinks

High-power LED package substrates, laser-diode submounts and heat sinks that pull heat away from junctions to protect lifetime and brightness.

Thermal Processes

Crucibles & Thermocouple Tubes

AlN crucibles for molten-metal and crystal-growth handling, plus thermocouple protection tubes resistant to wetting by aluminum and other melts.

Machined Shapes

Custom Machined Parts

Plates, discs, rings, rods and complex milled geometries with lapped surfaces and tight flatness — produced from your CAD drawing.

Metallized

Metallized & Brazed Assemblies

Tungsten / Mo-Mn metallized AlN with nickel plating, braze-assembled into housings, feedthroughs and multi-layer thermal stacks.

Frequently Asked Questions

Aluminum Nitride Questions, Answered

What thermal conductivity does your AlN reach?

Our two standard grades are DA-AN170 at ≥ 170 W/m·K and DA-AN200 at ≥ 200 W/m·K measured at 20 °C — roughly six to seven times the thermal conductivity of alumina — while remaining electrically insulating.

AlN or alumina for heat dissipation?

AlN, when heat has to move. The thermal-conductivity ratio is about 6:1 in favour of AlN, and its coefficient of thermal expansion (4.5 ×10⁻⁶/K) is closer to silicon, which reduces thermal stress on bonded dies. Choose alumina only when heat flux is low or cost dominates.

Do you supply metallized AlN substrates for power modules?

Yes. We produce AlN substrates and heat spreaders in plain, metallized (Cu or Al) and DBC/AMB-ready form for IGBT, SiC MOSFET and laser-diode packaging. Flatness and surface roughness are controlled to suit direct-bonding processes.

Is AlN suitable for electrostatic chucks and ceramic heaters?

Yes. AlN is a leading material for ceramic ESC bodies and ceramic heater cores in semiconductor equipment because it combines electrostatic clamping, electrical insulation and efficient heat transfer in a single part. We machine and metallize these components to drawing.

How does AlN behave at high temperature in air?

Dense, well-sintered AlN is stable in normal ambient conditions, with a maximum service temperature of about 900–1000 °C in air. Above that, oxidation accelerates, so for long high-temperature duty we recommend a controlled atmosphere — or silicon carbide, which tolerates higher temperatures in air.